Teradyne, Inc. (NASDAQ:TER), a leading provider of automated test equipment and advanced robotics, is excited to announce our participation at SEMICON China 2026, taking place March 25-27 at the Shanghai New International Expo Centre in Shanghai, China. Visitors are invited to experience Teradyne's latest innovations and connect with our experts at our booth in hall N2, booth 2371.

Teradyne is also a proud sponsor of the SEMICON China Design Innovation Forum: AI Intelligent Applications and Automotive ICs.

Teradyne will be showcasing four of our leading test solutions at our booth, each designed to address the evolving challenges of the advanced devices powering today's critical AI infrastructure.

Teradyne UltraFLEXplus is a scalable, future-ready platform for testing AI accelerators, xPUs, datacenter networking equipment and ADAS semiconductors, combining superior digital capabilities and robust power delivery to support the demanding test requirements of next-generation devices. Streamlined workflows and advanced automation speed time to market while delivering on rigorous quality standards.

Teradyne ETS-800 ensures clean, stable voltage and high-accuracy measurements for ultra-low resistance devices. Its efficient current delivery for measuring resistance supports mission-critical reliability and scalable production from low to high volume.

Teradyne Titan HP sets a new standard in system level test for AI and cloud devices with advanced active thermal control and multi-branch cooling, preventing overheating while optimizing test time. Currently supporting up to two kilowatts of power, with a roadmap to support four kilowatts in the near future, customers can be assured their investment today will meet the demanding requirements of tomorrow's devices as well.

Teradyne Magnum EPIC is a high-performance test solution for the latest generation of DRAM devices. Featuring a near-DUT test architecture, it delivers superior signal integrity performance at high data rates to enhance yield gain. With over 18,000 high-speed digital channels, the Magnum EPIC delivers high-speed clocks to enable device test speeds up to 12.12 Gbps with the high parallel capacity needed for testing high-volume DRAM devices.

Presentation at the Design Innovation Forum

On Thursday at 16:40, join us for our featured speaking session DevOpsForTest at the SEMICON China Design Innovation Forum: AI Intelligent Applications and Automotive ICs.

This year also marks a significant milestone for Teradyne as the company celebrates 25 years in China. Since establishing our first office in the region in 2001, Teradyne has played a pivotal role in supporting the rapid growth of China's semiconductor and electronics industries. Through close collaboration with local customers and ongoing investment in engineering and service capabilities, we remain committed to advancing innovation, fostering talent, and contributing to the development of China's technology ecosystem.

Explore our latest test solutions at our booth at SEMICON China. Find us in hall N2, booth 2371, and let's discuss how we can help you achieve your quality and productivity goals.

About Teradyne

Teradyne (NASDAQ:TER) designs, develops, and manufactures automated test equipment and advanced robotics systems. Its test solutions for semiconductors and electronics products enable Teradyne's customers to consistently deliver on their quality standards. Its advanced robotics business includes collaborative robots and mobile robots that support manufacturing and warehouse operations for companies of all sizes. For more information, visit teradyne.com. Teradyne^® is a registered trademark of Teradyne, Inc., in the U.S. and other countries.

View source version on businesswire.com: https://www.businesswire.com/news/home/20260323861011/en/

Amy McAndrews

Investor Relations

Tel 978.370.3945

investor.relations@teradyne.com

Teradyne to Showcase Leading Test Solutions at SEMICON China 2026