New test system advances printed circuit board and sub-assembly testing for AI and data center architectures.

Teradyne, Inc. (NASDAQ:TER), a leading provider of automated test equipment and advanced robotics, today announced the launch of Omnyx, a groundbreaking manufacturing test platform for printed circuit board assemblies (PCBA) and sub-assemblies, engineered to meet the unique test requirements of AI and data centers. Teradyne Omnyx sets a new standard by integrating structural, parametric, high-speed interconnect, and functional tests into a single platform, addressing critical manufacturing challenges to reduce defect escapes and improve the quality of final assemblies.

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Teradyne Omnyx advances printed circuit board and sub-assembly testing for AI and data center architectures.

Next-generation AI and data center products challenge conventional in-circuit test (ICT), which focuses on structural and parametric faults created during the assembly process. As data center assemblies increase in complexity and value, manufacturers require a comprehensive test platform to identify and address new signal integrity and operational defects prior to final assembly.

Teradyne Omnyx incorporates high-speed interconnect and mission-mode/software-directed tests providing coverage for at-speed and operational defects, typically only detectable at functional test insertions. With this approach, manufacturers improve component and sub-assembly quality by detecting costly defects earlier in the manufacturing process. This improves end-of-line yield and quality to meet the stringent requirements of today's high-performance data centers.

"Teradyne Omnyx represents a significant leap forward in PCBA testing, providing our customers with the tools they need to meet the demands of modern AI and data center hardware," said Mark Kahwati, general manager of the Production Board Test division at Teradyne. "This platform not only enhances product quality but also accelerates time to market, a critical factor in today's fast-paced environment. We're proud to deliver a solution that addresses the complex testing challenges our customers face as our industry innovates new solutions to support advanced AI applications."

The Teradyne Omnyx platform addresses the unique challenges of AI and data center infrastructure testing, where traditional manufacturing defect testing is no longer sufficient. Its comprehensive approach combines structural, parametric, operational, and high-speed interconnect testing to ensure economically scalable manufacturing.

To learn more about Teradyne Omnyx, visit us at IPC APEX EXPO, booth 2100, March 17 – 19 in Anaheim, California. For more information, visit http://www.teradyne.com/omnyx.

About Teradyne

Teradyne (NASDAQ:TER) designs, develops, and manufactures automated test equipment and advanced robotics systems. Its test solutions for semiconductors and electronics products enable Teradyne's customers to consistently deliver on their quality standards. Its advanced robotics business includes collaborative robots and mobile robots that support manufacturing and warehouse operations for companies of all sizes. For more information, visit teradyne.com. Teradyne^® is a registered trademark of Teradyne, Inc., in the U.S. and other countries.

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For more information, contact: 

Amy McAndrews 

Investor Relations 

Tel 978-370-3945 

investor.relations@teradyne.com

Teradyne Introduces Omnyx: Redefining Board Test for the AI Era