Compare · AMKR vs TSM
AMKR vs TSM
Side-by-side comparison of Amkor Technology Inc. (AMKR) and Taiwan Semiconductor Manufacturing Company Ltd. (TSM): market cap, price performance, sector, and recent activity on the wire.
Summary
- Both AMKR and TSM operate in Semiconductors (Technology), so they compete in similar markets.
- TSM is the larger of the two at $2.15T, about 133.7x AMKR ($16.10B).
- TSM has been more active in the news (12 items in the past 4 weeks vs 7 for AMKR).
- TSM has more recent analyst coverage (22 ratings vs 17 for AMKR).
- Company
- Amkor Technology Inc.
- Taiwan Semiconductor Manufacturing Company Ltd.
- Price
- $64.61-12.45%
- $409.60-7.90%
- Market cap
- $16.10B
- $2.15T
- 1M return
- -15.93%
- -
- 1Y return
- +226.97%
- -
- Industry
- Semiconductors
- Semiconductors
- Exchange
- NASDAQ
- NYSE
- IPO
- 1998
- 1997
- News (4w)
- 7
- 12
- Recent ratings
- 17
- 22
Amkor Technology Inc.
Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, the Middle East, Africa, and rest of the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, and test and drop shipment services. The company also provides flip chip scale package products for use in smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory, and as applications processors in mobile devices; and flip chip ball grid array products for various networking, storage, computing, and consumer applications. In addition, it offers wafer-level CSP packages that are used in power management, transceivers, sensors, wireless charging, codecs, and specialty silicon; wafer-level fan-out packages for use in ICs; and silicon wafer integrated fan-out technology, which replaces a laminate substrate with a thinner structure. Further, the company provides lead frame packages that are used in electronic devices for low to medium pin count applications; substrate-based wirebond packages, which are used to connect a die to a substrate; micro-electro-mechanical systems (MEMS) packages that are miniaturized mechanical and electro-mechanical devices; and advanced system-in-package modules, which are used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid state drives. It primarily serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.
Taiwan Semiconductor Manufacturing Company Ltd.
Taiwan Semiconductor Manufacturing Company Limited manufactures and sells integrated circuits and semiconductors. It also offers customer service, account management, and engineering services. The company serves customers in computer, communications, consumer, and industrial and standard segments in North America, Europe, Japan, China, and South Korea. Taiwan Semiconductor Manufacturing Company Limited was founded in 1987 and is headquartered in HsinChu, Taiwan.
Latest AMKR
- SEC Form SD filed by Amkor Technology Inc.
- Amkor Technology Inc. filed SEC Form 8-K: Regulation FD Disclosure, Financial Statements and Exhibits
- Amkor Technology to Host 2026 Investor Day and Ring Nasdaq Closing Bell
- EVP & General Counsel Rogers Mark N exercised 5,000 shares at a strike of $7.40 and sold $358,150 worth of shares (5,000 units at $71.63) as part of a pre-agreed trading plan (SEC Form 4)
- CFO Faust Megan sold $64,600 worth of shares (1,000 units at $64.60) as part of a pre-agreed trading plan, decreasing direct ownership by 0.75% to 133,138 units (SEC Form 4)
- Amkor Technology Expands U.S. Advanced Packaging Footprint with Additional Land in Arizona
- Amkor Technology Inc. filed SEC Form 8-K: Submission of Matters to a Vote of Security Holders
- SEC Form 4 filed by Director Alexander Douglas A
- SEC Form 4 filed by Director Carolin Roger Anthony
- SEC Form 4 filed by Member of 10% owner group (6) Kim Susan Y
Latest TSM
- SEC Form 6-K filed by Taiwan Semiconductor Manufacturing Company Ltd.
- AI's Power Crisis Is Accelerating a Potential $2.5 Trillion Hydrogen Market
- New insider Lu Chin-Sheng claimed ownership of 53,967 shares (SEC Form 3)
- New insider Ku Yao-Ching claimed ownership of 235,247 shares (SEC Form 3)
- New insider Wu Yi-Huang claimed ownership of 107,359 shares (SEC Form 3)
- SEC Form 6-K filed by Taiwan Semiconductor Manufacturing Company Ltd.
- SEC Form SD filed by Taiwan Semiconductor Manufacturing Company Ltd.
- SEC Form 6-K filed by Taiwan Semiconductor Manufacturing Company Ltd.
- SEC Form 4 filed by EVP and Co-COO Mii Yuh-Jier
- VP Tien Bor-Zen bought $6,718 worth of American Depositary Shares (17 units at $395.18), increasing direct ownership by 19% to 107 units (SEC Form 4)